First time I added the Thermal Relief to the layout rules it worked fine. But after some PCB editing, the thermal relief is no longer processed. It's still there and configured correctly. It has something to do with this particular design.
Also I noticed that Keep Out does not work on several Objects, in my case J4. The distance between GND plane and the pads on J4 cannot be changed. Why?
I would like you to help me resolve this problem since I can't generate the Gerber files for production and I would need to do that soon. Without thermal relief and the keep out rules correctly applied soldering will be very difficult.